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PCB Manufacturing Services

Equipment & Technology

Overview of the factory

With two manufacturing plants located in Huizhou and northern Jiangxi Province, we have a combined manufacturing space of 110,000 m² (1,180,000 ft²). In addition to our state-of-the-art production facilities, we have dedicated buildings for engineering and reliability labs, waste and water treatment, as well as employee living and recreational facilities. Our team consists of over 500 employees as of Q1-2023.

Equipped with advanced machinery and equipment, we are capable of producing PCBs with up to 40 layers. Our manufacturing capabilities include cutting-edge technologies such as HDI, Stacked Microvias, Blind/Buried Vias, and Low Dk/Df Materials. These capabilities enable us to provide innovative solutions for various industries, including security and defense, industrial control, communication, medical instruments, and automotive electronics.

Our dedicated R&D team collaborates closely with customers and industry experts to develop and implement novel processes and materials. Through these collaborative efforts, we have garnered recognition and praise from clients worldwide.

Rigid PCB Capabilities

Materials

FR4, High TG FR4, Halogen Free Material, CEM-3, Rogers HF Material, Aluminum

PTFE Laminates

Rogers series, Taconic series, Arion series, Nelco series, Taizhou Wangling F4BK series, TP series.

Hyrid Laminating

Rogers/Taconic/Arion/Nelco laminate with FR-4 material - including partial RO4350B hybrid laminating with FR-4

Layers

1 - 64 layers

Board Thickness:

0.1 - 10 mm

Soldermask Type (LPI)

Kuangshun, Taiyo, Himonia, Nanya, Onstatic, Chung Yu, MSDS

Soldermask Color

Green, Yellow, Black, Blue, Red, White, Purple, Orange, Matte green, Matte blue, Matte black

Surface Treatment

HASL, HASL-LF, OSP, ENIG, ENEIPG, Hard gold, Gold finger

Min.Line/Track Width

3mil

Min.Mechanical Drill Hole

0.10mm

MIN.Drilling Slot Size

0.6mm

Copper Thickness

20oz MAX

Legend/Silkscreen Color

Black, White, Yellow, and others.

Other Technology

Peelable Mask, Carbon ink, Non-across Blindried Vias, Characteristic Impedance Control, VIA IN PAD etc.

HDI

1+N+1, 2+N+2, 3+N+3, Anylayer HDI.

Buried & Blind VIA

4 - 64 layers, 0.5 - 10mm (Board Thickness).

Rigid-Flex PCB Capabilities

Flex & Rigid-Flex PCBs

1 - 10 layers Flex PCB & 2 - 20 layers Rigid-flex PCBs

FCCL (adhesive)

Shengyi SF305, PI = 1mil and 2mil, Cu = 0.33oz & 0.5oz & 1oz
Panasonic R-F5775(ER), PI = 1mil and 2mil, Cu = 0.33oz & 0.5oz & 1oz
Dupont Pyralux AP, PI = 1mil and 2mil, Cu = 0.5oz & 1oz

Coverlay

Shengyi SF305C & 0515 & 0525 & 1025 & 2030; Talflex FHK 1025 & 1035

NO FLOW PP

Ventec: vt-47n(TG170) & em-285b(TG150)

CCL

ITEQ: IT180A
Shengyi: S1000H & S1000-2
Arlon: 85N
Nelco: N4000-13 series

Board Thickness

0.3 - 3.0 mm

Board Size

10mm * 15mm Min
406.4mm * 558.8mm Max

Min. BGA pad size

12mil (8mil for electrical soft gold board)

Surface Treatment

HASL, HASL-LF, ENIG, ENEPIG, Hard Gold, Immersion silver, Immersion tin, OSP.

Bow & Twist

0.75% (symmetrical)

Other Techniques:

HDI
Gold Fingers
Stiffener (Only for PI / FR4 Substrate)

Di PCB Capabilities

Feature

Capacity

HDI PCB type :

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm)

Blind&buried via type:

mechanical blind&burried vias with less than 2 times laminating; Laser blind via

Min laser drilling size:

4mil

Max laser drilling size:

6mil

Finshed mechanical hole size:

5-244mil(corresponding drilling tool size 8-248mil)

MAX aspect ratio for Hole plate:

10:1

Max aspect ratio for laser via filling plating:

0.9:1(Dpeth included copper thickness)

Min gap between hole wall and conductor (None blind and buried via PCB):

7mil(≤8L),9mil(10-14L),10mil(>14L)

Min gap between hole wall conductor (Blind and buried via PCB):

8mil(1 times laminating),10mil(2 times laminating), 12mil(3 times laminating)

Min gab between hole wall conductor (Laser blind hole buried via PCB):

7mil(1+N+1);8mil(1+1+N+1+1 or 2+N+2)

Min space between laser holes and conductor:

6mil

Min space bwteen hole walls in different net:

10mil

Min Pad size for laser drillings:

10mil(for 4mil laser via),11mil(for 5mil laser via)

Min Pad size for mechanical drillings:

16mil(8mil drillings)

The Different Types Of Hdi Printed Circuit Boards Structures

With the capacity to produce HDI PCBs of up to 32 layer,depending on the unique requirements of each project. Below is a table outlining the different types of HDI PCB structures we can create.

HDI PCB Structures

The Various categories of
Micros Vias

Large-Scale Production

Small to Medium-Scale
Production

Prototype

Available

1+N+1

Blind vias

Yes

Yes

Yes

Over 4 layers

2+N+2

Blind/Buried staggered vias

Yes

Yes

Yes

Over 6 layers

2+N+2

Blind/Buried stacked vias

Yes

Yes

Yes


Over 6 layers

3+N+3

Blind/Buried stacked vias

/

Yes

Yes


Over 8 layers

3+N+3

Blind/Buried stacked vias

/

/

Yes

Over 8 layers

Advanced Equipments Show